Dicing
During the recent years, Spectrogon has improved the dicing capability significantly. This improvement is a collective result of considerable investments in high precision equipment and rigorous developmental work. Diced filters down to 1.0×1.0 mm and with an edge chipping of < 100 µm can be offered.
We also have a step dicing process for filters with Silicon and Germanium substrate materials. To minimize handling and costs, the diced filters are preferable delivered on tape. A pick-and-place robot can then be used to mount the chips. Wafers with a diameter of up to 200 mm can be accommodated in our dicing facility.
Spectrogon’s custom sizing services also include turning down the diameter of filters according to the customer’s demands. Price for step dicing according to request.
Dicing prices for different substrates and tolerances for Ø25.4 mm and Ø100.0 mm wafers are presented in the tables below. For larger quantities and/or other wafer dimensions please contact our sales department.
|
Substrate (Ø25.4 mm) |
Tolerances (± mm) |
Chipping (µm) |
Price/pc (€) > 3.0×3.0 mm |
Price/pc (€) ≤ 3.0×3.0 mm |
Price/pc ($) > 3.0×3.0 mm |
Price/pc ($) ≤ 3.0×3.0 mm |
| Sapphire (standard) | 0.10 | < 200 | 350,00 | 420,00 | 402,00 | 483,00 |
| Sapphire (tough) | 0.025 | < 100 | 480,00 | 575,00 | 552,00 | 661,00 |
| Quartz (standard) | 0.10 | < 200 | 350,00 | 420,00 | 402,00 | 483,00 |
| Quartz (tough) | 0.025 | < 100 | 480,00 | 575,00 | 552,00 | 661,00 |
| Glass (standard) | 0.10 | < 200 | 225,00 | 260,00 | 259,00 | 299,00 |
| Glass (tough) | 0.025 | < 100 | 300,00 | 350,00 | 345,00 | 402,00 |
| Silicon | 0.05 | < 100 | 225,00 | 260,00 | 259,00 | 299,00 |
| Germanium | 0.05 | < 100 | 300,00 | 350,00 | 345,00 | 402,00 |
Approximate number of chips per Ø25.4 mm filters for different dimensions and substrates.
| Dimension (mm) | Sapphire / Quartz / Glass | Silicon / Germanium |
| 1.0×1.0 | – | 347 |
| 2.0×2.0 | 68 | 80 |
| 3.0×3.0 | 29 | 33 |
| 4.0×4.0 | 14 | 19 |
| 5.0×5.0 | 11 | 11 |
| 6.0×6.0 | 5 | 5 |
|
Substrate (Ø100.0 mm) |
Tolerances (± mm) |
Chipping (µm) |
Price/pc (€) > 3.0×3.0 mm |
Price/pc (€) ≤ 3.0×3.0 mm |
Price/pc ($) > 3.0×3.0 mm |
Price/pc ($) ≤ 3.0×3.0 mm |
| Sapphire (standard) | 0.10 | < 200 | 875,00 | 1050,00 | 1005,00 | 1207,00 |
| Glass (standard) | 0.10 | < 200 | 562,00 | 650,00 | 647,00 | 747,00 |
| Silicon | 0.05 | < 100 | 562,00 | 650,00 | 647,00 | 747,00 |
| Germanium | 0.05 | < 100 | 750,00 | 875,00 | 862,00 | 1005,00 |
Approximate number of chips per Ø100.0 mm wafer for different dimensions and substrates.
| Dimension (mm) | Sapphire / Glass | Silicon / Germanium |
| 1.0×1.0 | – | 6063 |
| 2.0×2.0 | 1269 | 1539 |
| 3.0×3.0 | 591 | 677 |
| 4.0×4.0 | 339 | 379 |
| 5.0×5.0 | 217 | 239 |
| 6.0×6.0 | 149 | 162 |